Split gate flash memory cell and manufacturing method thereof

ABSTRACT

A split gate flash memory cell includes a substrate having a trench, a stack structure disposed on the substrate, wherein the stack structure includes a tunneling dielectric layer, a floating gate and a cap layer; a first inter-gate dielectric layer and a second inter-gate dielectric layer disposed on the sidewalls of the stack structure, wherein the first inter-gate dielectric layer is contiguous to the top of the trench; a selective gate disposed on the sidwalls of the first inter-gate dielectric layer and the trench; a selective gate dielectric layer disposed between the selective gate and the substrate; a source region configured in the substrate beside the side of the stack structure with the second inter-gate dielectric layer; and a drain region configured at the bottom of the trench beside one side of the selective gate.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of a prior application Ser. No.10/604,612, filed Aug. 5, 2003 now U.S. Pat. No. 6,768,162.

BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device. Moreparticularly, the present invention relates to a split gate flash memorycell and a manufacturing method thereof.

2. Description of Related Art

A flash memory device provides the property of multiple entries,retrievals and erasures of data. Moreover, the stored information isretained even electrical power is interrupted. As a result, anon-volatile memory device is widely used in personal computers andelectronic systems.

A typical flash memory device employs doped polysilicon to fabricate thefloating gate and the control gate. Further, a dielectric layer is usedto isolate the floating gate from the control gate, whereas the floatinggate and the substrate are isolated from each other by a tunneling oxidelayer. When a flash memory device performs the write/erase operation ofinformation, proper biases are applied to the control gate and thesource/drain regions to inject electrons into or to discharge electronsfrom the floating gate. Further, the reading of information from a flashmemory device is achieved by applying a working voltage to the controlgate. The conductive state of the floating gate influences theopening/closing of the channel, wherein the opening/closing of thechannel can be interpreted as the binary value of either “0” or “1”.

During the erasure of information of the above flash memory device, theamount of electrons being discharged is difficult to control. Therefore,over-erase is resulted when an excessive amount of the electrons orpositive charges are discharged from the floating gate. When theover-erase phenomenon is serious, a channel current flow is inducedunder the floating gate even no working voltage is applied to thecontrol gate, leading to an erroneous interpretation of the data.

To resolve the over-erase problem, a split gate flash memory device isintroduced by the industry. FIG. 1 is a schematic, cross-sectional viewof a split gate flash memory according to the prior art. As shown inFIG. 1, the flash memory cell includes, sequentially from the substrate100, a tunneling dielectric layer 102, a floating gate 104, aninter-gate dielectric layer 106 and a selective gate electrode 108. Theselective gate electrode 108 is configured above and at the periphery ofthe floating gate 104, wherein a portion of the selective gate 108extends over a part of the substrate 100. The selective gate electrode108 and the floating gate 104 are isolated from each other by aselective gate dielectric layer 110. The source region 112 is configuredin the substrate 100 at one side of the floating gate 104, while thedrain region 114 is disposed in the substrate 100 and is extended fromone side of the selective gate electrode 108. Therefore, even when anover-erase phenomenon is serious, in which the channel under thefloating gate 104 remains open when no working voltage is applied to theselective gate electrode 108, the channel under the selective gateelectrode 108 still remains close to preclude a current flow between thedrain region 114 and the source region 112 and to obviate an erroneousinterpretation of the data.

A split gate structure, on the other hand, demands a larger split gateregion and a larger memory cell dimension. The dimension of a split gatememory cell is thus larger than the dimension of the memory cell withthe stack gate structure. Increasing the integration of devices therebybecomes difficult.

The increase of integration of integrated circuits by theminiaturization of device is achieved by reducing the gate length of amemory device. However, as the gate length is being reduced, theunderlying channel length is also reduced. During the programming ofsuch a memory cell, abnormal punch through thus easily occurs betweenthe source region and the drain region, adversely affecting theelectrical performance of the memory device.

Further, during the fabrication of the above flash memory device, thereis a mask alignment problem in forming the selective gate electrode. Thechannel, which underlies the part of the selective gate electrode thatextends over the substrate, can not be accurately defined. In otherwords, if misalignment occurs during patterning of the selective gateelectrode, the channel lengths of two neighboring memory cells thatshare a common source region are not consistent. Asymmetric programmingof the memory cells is thereby resulted, leading to differentcharacteristics of two memory cells.

SUMMARY OF INVENTION

Accordingly, the present invention provides a split gate flash memorycell and a fabrication method thereof, wherein the punch throughphenomenon generated at the source region and the drain region duringthe programming operation can be prevented to increase the effectivenessof a memory cell.

The present invention further provides a split gate flash memory celland a fabrication method thereof, wherein a self-alignment process isused to form the selective gate electrode to prevent the problem ofinconsistent channel lengths between two memory cells, and therebyobviating the problem of asymmetric programming of memory cells toincrease the effectiveness of the memory cell.

The present invention also provides a split gate flash memory cell and afabrication method thereof, wherein the selective gate is formed over asidewall of floating gate and is extended from the floating gatesidewall to the trench sidewall in the substrate. The dimension of thememory cell can be reduced to increase the integration of the memorydevice.

The present invention provides a split gate flash memory cell, whereinthe split gate flash memory cell is formed with a substrate, a stackstructure, a first inter-gate dielectric layer, a second inter-gatedielectric layer, a selective gate electrode, a selective gate electrodedielectric layer, a source region and a drain region. The substratefurther includes a trench. The stack structure is disposed on thesubstrate, and the stack structure includes, sequentially from thesubstrate, a tunneling dielectric layer, a floating gate and a caplayer. The first inter-gate dielectric layer is disposed on the sidewallat the first side of the stack structure, wherein the first inter-gatedielectric layer is contiguous to the top part of the trench. The secondinter-gate dielectric layer is disposed on the sidewall at the secondside of the stack structure. The selective gate electrode is configuredon the sidewalls of first side of the stack structure and the trench.The source region is configured in the substrate beside the second sideof the stack structure, while the drain region is configured at thebottom of the trench beside one side of the selective gate electrode.

The selective gate electrode of the split gate flash memory cell of thepresent invention is disposed on the sidewalls of the trench and of thefirst side of the stack structure. The channel region is therebyconfigured along the sidewall of the trench in the substrate (a verticalchannel), wherein the channel length is determined by the depth of thetrench. Therefore, even the device dimension (gate length) is reduced,the channel length can be accurately controlled by controlling thetrench depth. The problem of a current flow between the source regionand the drain region after the programming operation can be prevented.Further, the integration of the device can also increase.

The present invention further provides a fabrication method for a splitgate flash memory device, wherein the method provides a substrate havinga stack structure already formed thereon. Further, the stack structureincludes a tunneling dielectric layer, a floating gate and a cap layer,sequentially from the substrate. After forming a source region in thesubstrate beside a first side of the stack structure, an inter-gatedielectric layer is formed on the sidewall of the stack structure.Thereafter, a trench is formed in the substrate beside a second side ofthe stack structure. Subsequent to the formation of a selective gate onthe sidewall at the second side of the stack gate and on the sidewall ofthe trench, a drain region is formed at the bottom of the trench besideone side of the selective gate.

In accordance to the fabrication method for a split gate flash memorycell of the present invention, the selective gate is formed by aself-alignment method and not by a photolithography technique. Theprocess window is increased, and the processing time and cost are scaleddown. Moreover, the problems of inconsistent channel lengths betweenneighboring memory cells and asymmetric programming of memory cells areprevented to increase the reliability of the memory device.

Further, the selective gate is formed on the sidewalls of the stackstructure and the trench, the channel region of the selective gate isconfigured in the substrate along the sidewall of the trench (verticalchannel region). Therefore, even the device dimension (gate length) isreduced, the channel length is accurately controlled by controlling thedepth of the trench. The problem of a current flow between the sourceregion and the drain region after programming is prevented. Further, theintegration of device can also increase.

The present invention further provides a fabrication method for a splitgate flash memory device, wherein the method includes forming atunneling dielectric layer, a first conductive layer and a mask layersequentially on a substrate. A patterned mask layer is formed to exposea portion of the first conductive layer, and a cap layer is formed onthe exposed first conductive layer. Thereafter, the mask layer isremoved. Further using the cap layer as a mask, the first conductivelayer and the tunneling dielectric layer are etched to form a stackstructure. A source region is formed in the substrate beside a firstside of the stack structure. An inter-gate dielectric layer is formed onthe sidewall of the stack structure. Thereafter, a trench is formed inthe substrate beside the second side of the stack structure. A selectivegate dielectric layer is formed on the sidewall and at the bottom of thetrench, and a second conductive layer is formed over the substrate. Aportion of the second conductive layer is removed to form a conductivespacer on the sidewall at the first side of the stack structure, and aselective gate on the sidewall at the trench and the sidewall at thesecond side of the stack structure. A drain region is then formed at thebottom of the trench at one side of the selective gate.

In accordance to the fabrication method for a split gate flash memorycell of the present invention, after removing a portion of theconductive layer to form a conductive spacer on the sidewall at thefirst side of the stack structure, and a selective gate on the sidewallat the second side of the stack structure and the sidwall of the trench,and forming the drain region further includes performing an etching stepto remove the conductive spacer.

Further, in accordance to the fabrication method for a split gate flashmemory cell of the present invention, the selective gate is formed by aself-alignment method and not by a photolithography technique. Theprocess window is thus increased, and the processing time and cost arereduced. Moreover, the problems of inconsistent channel lengths betweenneighboring memory cells and asymmetrical programming of memory cellsare prevented to increase the reliability of the memory device.

Further, the selective gate is formed on the sidewalls of the stackstructure and the trench, the channel region of the selected gate isconfigured in the substrate along the sidewall of the trench (verticalchannel region). Therefore, even the device dimension (gate length) isreduced, the channel length is accurately controlled by controlling thedepth of the trench. The problem of a current flow between the sourceregion and the drain region after programming is prevented. Further, theintegration of device can also increase.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is a schematic, cross-sectional view illustrating the structureof a split gate flash memory cell according to the prior art.

FIG. 2 is a schematic, cross-sectional view illustrating the structureof a split gate flash memory cell according to one exemplary embodimentof the present invention.

FIGS. 3A to 3H are schematic, cross-sectional views illustrating theprocess flow for fabrication a split gate flash memory cell according toone exemplary embodiment of the present invention.

DETAILED DESCRIPTION

FIG. 2 is a schematic, cross-sectional view illustrating the structureof a split gate flash memory cell according to one exemplary embodimentof the present invention.

Referring to FIG. 2, the flash memory cell of the present invention isincluded with a substrate 200, a tunneling-dielectric layer 202, afloating gate 204, a cap layer 206, an inter-gate dielectric layer 208a, an inter-gate dielectric layer 208 b, a selective gate dielectriclayer 210, a selective gate 212, a source region 214 and a drain region216.

The substrate 200 includes a trench 218. The floating gate 204 isdisposed on the substrate 200. The tunneling dielectric layer 202 isdisposed between the floating gate 204 and the substrate 200. Thetunneling dielectric layer 202 is formed with, for example, siliconoxide. The cap layer 206 is disposed on the floating gate 204, whereinthe cap layer 206 is formed with a material, such as, silicon oxide. Thetunneling dielectric layer 202, the floating gate 204 and the cap layer206 together constitute a stack structure 222. The inter-gate dielectriclayer 208 a is disposed on a sidewall of the stack structure 222,wherein the inter-gate dielectric layer 208 a is contiguous to the toppart of the trench 218. The inter-gate dielectric layer 208 b isdisposed on another sidewall of the stack structure 220. The inter-gatedielectric layer 208 a and the inter-gate dielectric layer 208 b areformed with a material that includes, for example, silicon oxide/siliconnitride or silicon oxide/silicon nitride/silicon oxide. The selectivegate 212 is disposed on the sidewalls of the stack structure 222, theinter-gate dielectric layer 208 a and the trench 218. The selective gate212 is formed with a material that includes, for example, dopedpolysilicon. The selective inter-gate dielectric layer 210 is disposedbetween the selective gate 212 and the trench 218. The source region 214is configured in the substrate 200 beside one side of the inter-gatedielectric layer 208 b of the stack structure 222. The drain region 218is configured at the bottom of the trench 218 beside one side of theselective gate 212.

In accordance to the above embodiment of the present invention, theselective gate 212 is disposed on the sidewalls of the cap layer 206,the inter-gate dielectric layer 208 a and the trench 218. The channelregion 220 is thereby configured in the substrate along the sidewall ofthe trench 218 (a vertical channel region). Further, the length of thechannel region 220 is determined by the depth of the trench 218.Therefore, even the device dimension (the gate length) is reduced, thechannel length can be accurately controlled by controlling the depth ofthe trench 218. Any unwanted current flow between the source region andthe drain region after the programming operation is thus prevented.

Further, since the selective gate 212 is disposed on the sidewalls ofthe cap layer 208, the inter-gate dielectric layer 208 a and the trench218, the dimension of the memory cell can be reduced to increase theintegration of the device.

FIGS. 3A to 3H are schematic, cross-sectional views illustrating theprocess flow for fabrication a split gate flash memory cell according toone exemplary embodiment of the present invention.

Referring to FIG. 3A, a substrate 300 is provided, wherein the substrate300 is, for example, a silicon substrate, and the substrate 300 isalready formed with device isolation structure (not shown in diagram).The device isolation structure is, for example, stripe shape, and isused to define an active region. The device isolation structure isformed by, for example, local oxidation (LOCOS) or shallow trenchisolation (STI). A tunneling dielectric layer 302 is then formed on thesubstrate 300, wherein the tunneling dielectric layer 302 is, forexample, silicon oxide. The tunneling dielectric layer 302 is formed by,for example, thermal oxidation.

A conductive layer 304 is then formed on the tunneling dielectric layer302. The conductive layer 304, for example, a doped polysiliconmaterial, is formed by, for example, forming an undoped polysiliconlayer using chemical vapor deposition, followed by conducting an ionimplantation process.

A mask layer 306 is further formed on the conductive layer 304, whereinthe mask layer 306, formed with a material, such as, silicon nitride, isformed by, for example, chemical vapor deposition. Thereafter, the masklayer 306 is patterned to form a plurality of openings 308 that exposethe conductive layer 304.

Referring to FIG. 3B, a cap layer 310 is formed on the conductive layer304 exposed by the opening 308. The cap layer 310, such as, a siliconoxide material, is formed by, for example, thermal oxidation. After thecap layer 310 is formed, the mask layer 306 is removed. Further usingthe cap layer 310 as a self-alignment mask, the conductive layer 304,the tunneling dielectric layer 302 are etched until the substrate 300 isexposed to form the conductive layer 304 a and the tunneling dielectriclayer 302 a. The cap layer 310, the conductive layer 304 a and thetunneling dielectric layer 302 a form a stack structure 312, wherein theconductive layer 304 a serves as the floating gate of a memory cell.

Continuing to FIG. 3C, a patterned photoresist layer 314 is formed onthe substrate 300. The patterned photoresist layer 314 exposes apredetermined region for a source region. An ion implantation step isconducted to form the source region 316 in the substrate 300 beside oneside of the stack structure 312.

Referring to FIG. 3D, the patterned phototresist layer 314 is removed.An inter-gate dielectric layer 318 a and an inter-gate dielectric layer318 b are then formed on the sidwalls of the stack structure 312. Theinter-gate dielectric layer 318 a and the inter-gate dielectric layer318 b are formed with materials, such as, silicon oxide/silicon nitride,etc. The inter-gate dielectric layer 318 a and the inter-gate dielectriclayer 318 b are formed by, for example, forming a silicon oxide layer bythermal oxidation and forming a silicon nitride layer using low pressurechemical vapor deposition, followed by conducting an anisotropic etchingstep to remove portions of the silicon oxide layer and the siliconnitride layer.

As shown in FIG. 3E, another patterned photoresist layer 320 is formedover the substrate 300. This patterned photoresist layer 320 covers thearea over the source region 316. Thereafter, using the patternedphotoresist layer 320 and the stack structure 312 with the inter-gatedielectric layer 318 a and the inter-gate dielectric layer 318 b as amask, an etching step is conducted to form a trench 322 in the substrate300 beside one side of the inter-gate dielectric layer 318 a.

Referring to FIG. 3F, after removing the patterned photoresist layer320, a dielectric layer 324 is formed at the bottom and on the sidewallof the trench 322. The dielectric layer 324 includes, for example,silicon oxide, and is formed by, for example, thermal oxidation. Adielectric layer 326 is also formed on the source region 316. Further, athin silicon oxide layer can be formed on the surface of the inter-gatedielectric layers 318 a, 318 b. The inter-gate dielectric layers 318 a,318 b are thus formed with a silicon oxide/silicon nitride/silicon oxidestructure.

Thereafter, a conductive layer 328 is formed on the sidewall of thetrench 322 and on the sidewall of the stack structure 312 with theinter-gate dielectric layer 318 a. This conductive layer 328 serves asthe selective gate of the split gate flash memory cell. The conductivelayer 328 is formed by, for example, forming a conductive material layer(not show) on the substrate 300, followed by performing an anisotropicetching process to remove a portion of the conductive material layer toform the conductive layer 328 on the sidewall of the trench 322 and onthe sidewall of the stack structure 312 with the inter-gate dielectriclayer 318 a. In this process step, a conductive spacer 330 is alsoformed on the sidewall of the stack structure 312 where the inter-gatedielectric layer 318 b is formed. A material for forming the conductivelayer 328 and the conductive spacer 330 includes doped polysilicon.Further, the conductive layer 328 and the conductive spacer 330 areformed by, for example, using chemical vapor deposition to form a dopedpolysilicon layer, followed by performing an ion implantation step.

Continuing to FIG. 3G, a patterned photoresist layer 332 is formed overthe substrate 300, wherein the patterned photoresist layer 332 exposesthe area above the source region 316. An etching step is then performedto remove the conductive spacer 330. A method for removing theconductive spacer 330 includes, for example, wet etching or dry etching.In this exemplary embodiment of the present invention, the conductivespacer 330 of the two neighboring memory cells are electricallyconnected, mutual interference thus easily occurs between the twoneighboring memory cells during operations. Therefore, the conductivespacer 330 needs to be removed. If the conductive spacers 330 of the twoneighboring memory cells are not connected, the removal of theconductive spacer 330 is not required.

Continuing to FIG. 3H, after the patterned photoresist layer 332 isremoved, another patterned photoresist layer (not shown in Figure) isformed on the substrate 300. This patterned photoresist layer exposesthe predetermined region for the formation of a drain region. An ionimplantation process is then conducted to form the drain region 334 atthe bottom of the trench 322 beside one side of the conductive layer328.

In the above exemplary embodiment, the selective gate (conductive layer328) is formed on the sidewalls of the stack structure 312 and thetrench 322. The channel region of the selective gate (conductive layer328) is configured along the sidewall of the trench 322 in the substrate300 (vertical channel). Therefore, even the device dimension (gatelength) is reduced, the channel length can be accurately controlled bycontrolling the depth of the trench 322. The problem of a current flowbetween the source region and the drain region after a programmingoperation is thereby prevented.

Further, the selective gate (conductive layer 328) is formed on thesidewalls of the stack structure 312 and the trench 322. The devicedimension can be reduced to increase the integration of the device.

Additionally, the selective gate (conductive layer 328) of the presentinvention is formed by a self-alignment method. Since the application ofthe photolithography technique is precluded, the process window isincreased, while the manufacturing cost and time are reduced.

Moreover, the selective gate (conductive layer 328) of the presentinvention is formed by a self-alignment method. The two neighboringmemory cells are formed with the same channel lengths. Therefore, duringthe operation of the flash memory device, the problem of asymmetricprogramming of memory cells can be prevented to increase the reliabilityof the memory device.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. A fabrication method for a split gate flashmemory cell, comprising: providing a substrate; forming a stackstructure on the substrate, wherein the stack structure is formed with,sequentially from the substrate, a tunneling dielectric layer, afloating gate and a cap layer; forming a source region in the substratebeside a first side of the stack structure; forming inter-gatedielectric layers on sidewalls of the stack structure; forming a trenchin the substrate beside a second side of the stack structure; forming aselective gate dielectric layer at a bottom and on a sidewall of thetrench; forming a selective gate on the sidewall at the second side ofthe stack structure and on the sidewall of the trench; and forming adrain region at the bottom of the trench beside a side of the selectivegate.
 2. The method of claim 1, wherein the step of forming theselective gate on the sidewall at the second side of the stack structureand the sidewall of the trench comprises: forming a conductive layer onthe substrate; and removing a portion of the conductive layer to form aconductive spacer on the sidewall at the first side of the stackstructure, and the selective gate on the sidewall at the second side ofthe stack structure and the sidewall of the trench.
 3. The method ofclaim 2, wherein the step of removing the portion of the conductivelayer comprises performing an anisotropic etching method.
 4. The methodof claim 2, wherein after forming the selective gate on the sidewall atthe second side of the stack structure and the sidewall of the trenchfurther comprises a step of removing the conductive spacer.
 5. Themethod of claim 1, wherein the step of forming the inter-gate dielectriclayers on the sidewalls of the stack structure comprises: forming asilicon oxide layer on the sidewall of the floating gate; and forming asilicon nitride layer on the silicon oxide layer.
 6. The method of claim1, wherein the steps of forming the inter-gate dielectric layer at thebottom and on the sidewall of the trench comprises performing a thermaloxidation method.
 7. A fabrication method for a split gate flash memorydevice, comprising: providing a substrate; forming a tunnelingdielectric layer, a first conductive layer and a mask layer sequentiallyon a substrate; patterning the mask layer to form an opening thatexposes a portion of the first conductive layer; forming a cap layer onthe exposed first conductive layer; removing the mask layer; etching thefirst conductive layer and the tunneling dielectric layer to form astack structure, using the cap layer as a mask; forming a source regionin the substrate beside a first side of the stack structure; forminginter-gate dielectric layers on sidewalls of the stack structure;forming a trench in the substrate beside a second side of the stackstructure; forming a selective gate dielectric layer on a sidewall andat a bottom of the trench; forming a second conductive layer on thesubstrate; removing a portion of the second conductive layer to form aconductive spacer on the sidewall at the first side of the stackstructure, and a selective gate on the sidewall at the second side ofthe stack structure and on the sidewall of the trench; and forming adrain region at the bottom of the trench beside a side of the selectivegate.
 8. The method of claim 7, wherein the step of removing the portionof the second conductive layer includes anistropic etching.
 9. Themethod of claim 7, wherein after the steps of removing the portion ofthe second conductive layer to form the conductive spacer on thesidewall at the first side of the stack structure, and the selectivegate on the sidewall at the second side of the stack structure and onthe sidewall of the trench, and forming the drain region at the bottomof the trench at the one side of the selective gate, the method furthercomprises a step of removing the conductive spacer.
 10. The method ofclaim 7, wherein the step of forming the inter-gate dielectric layers onthe sidewalls of the stack structure comprises: forming a silicon oxidelayer on a sidewall of the floating gate; and forming a silicon nitrideon the silicon oxide layer.
 11. The method of claim 7, the selectivegate dielectric layer on the sidewall and at the bottom the trench isformed by a thermal oxidation method.
 12. The method of claim 7, whereinthe step of forming the cap layer on the exposed first conductive layercomprises performing thermal oxidation.